IC Packages

Dimensional Measurement of IC Package

An IC Package is a component that protects ICs, which are semiconductor integrated circuits, which also make an electric connection with the printed circuit board on the outside possible. Just as many electronic devices are becoming miniaturized, IC packages are also being miniaturized and densified. Although packages take various forms depending on factors such as type of IC and size, Sinto S-Precision meets the demands for dimensional management during the manufacturing process for every package component.

Measurement of Photomask

The high-density package component’s pattern is formed using photolithography technology, which involves printing the pattern using a original production master. Measurements of the position, width, spacing and diameter of the pattern of the photomask (which is mainly used as a original production master ) are made. Efficiency of this operation can be increased by creating a measurement program based on the pattern design data (which is CAD data) obtained from the optional software C-Auto.

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Measurement of Lead Frame

A component called a lead frame, which is made from the processing of the thin metal sheet and acts as a connection between the IC and the outside part, is used in IC packages such as SOP*1 and QFP*2. Advancements are being made year by year to the intricacy of the inner lead in particular, which is the component connecting to the IC side. This makes the measurement of this part increasingly important.

  • *1 SOP;Small Outline Package(Has metal pins extending in 2 directions from the 2 sides facing the body of the package)
  • *2 QFP;Quad Flat Package(Has metal pins extending in 4 directions from each side of the body of the package)

QFP Package

Measurement Outline

Examples of Lead Frame Measurements

Measurements are made of the width and spacing of the inner and outer leads and of the dimensions of the IC mounted area (Die Pad ). Measurement of width and spacing of the part requested by a user is possible through a special measurement program used especially during measurement of the inner lead. In addition, the optional laser auto focus displacement meter is used to measure the height (flatness) of the inner lead and to measure the height (flatness) of the outer lead after packaging.

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Measurement of BGA/CSP Packages

BGA Package

The BGA Package has an arrangement of solder balls (bumps) in a lattice on the bottom of the IC equipped BGA substrate, allowing an electric connection with the outside. The CSP is a further miniaturized version of this. In contrasts to QFPs and the like, the part that connects to the outside is not on the exterior of package body, allowing a corresponding reduction in size. However, more precise dimensional management becomes necessary.

  • *1 BGA; Ball Grid Array
  • *2 CSP; Chip Size Package
Measurement Outline

Examples of BGA Package Measurements

The main measurements made are of the components that make an electric connection between the BGA/CSP circuit board and the IC side or the exterior. Since not only the measurements of position and diameter of the area where the bumps connect, but also of the uniform height of the bumps become important, an optional laser auto focus displacement meter is used to measure the height of the land before the molding of the bumps and the uniformity (co-planarity) of the height of the bumps after molding.

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Measurement of TAB/COF

The TAB/COF does not have a rigid circuit board just like the BGA and CSP, using the method of directly equipping the IC onto film (tape). The connecting portion of the IC to be directly equipped has become highly intricate and requires very precise dimensional measurement.

  • *1 TAB; Tape Automated Bonding
  • *2 COF; Chip On Film
Measurement Outline

LCD Panel

The main measurements to be made are of the width and spacing of the inner and outer leads. The IC connecting portion (the inner lead portion) uses especially delicate wiring. The measurement of the inner lead uses a special measurement program to measure the width and spacing of the part requested by the user.

Measurement of COF used as Driver for Liquid Crystal Display

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